Semiconductor Fab POU Abatement

The US share of global chip manufacturing is a shadow of its former self: in 1990, it was 37%; today, 12%. CHIPS Act funding will change that, as Intel, TSMC, Micron and others build greenfield or expanded fabs.

For them to achieve full potential, however, these fabs will need reliable, cost-effective POU (Point-of-Use) abatement solutions to some of the most challenging stack emissions in industry.

Hydrochloric and hydrofluoric acids, arsenic, phosphine, toxic and combustible gases, solvents, perfluorocarbons and heavy metals are commonplace in semiconductor manufacturing, and in most cases, lack viable substitutes. Solutions developed for individual facilities have historically been cloaked in NDAs.

Protecting customers’ proprietary information has been our priority for the 3 decades that Tri-Mer has served semiconductor fabs.

Tri-Mer wet scrubbers and catalytic filtration systems have served some of the most prominent names in electronics, chips and printed circuit boards.

Arizona 34

Ultra Scrub Wet Scrubbers
Tri-Nox® Multi-Chem® System
Tri-Mer® Centrifugal Blowers
California 10
15
Wet Scrubbers
Tri-Mer® Centrifugal Blowers
Texas 6
7
3
Multi-Stage Ultra Scrub Wet Scrubbers
Tri-Mer® Centrifugal Blowers
Horizontal Packed Scrubbers
New Mexico 1 Tri-Nox® Multi-Chem® System

Our engineering is solid, our manufacturing is 100% US, and our Michigan-based technical support team is the best in the industry.

Chart comparing semiconductor chip Manufacturing Process steps with pollutant source and pollutant type.

Tri-Mer has quietly designed and manufactured efficient reliable air emissions solutions for technology companies since the 1990s. You know our customers, and soon you’ll know a solid, proven solution to air emissions for your project.

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